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| | ONLINE | ISSN | : | 1347-5371 | | PRINT | ISSN | : | 1340-8054 |
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| | JSME International Journal Series B |
| Vol. 44 (2001) , No. 4 Special Issue on Flow-Induced Vibration of Bluff Bodies pp.592-598 |
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 | Development of Micro Channel Heat Exchanging
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| | 1) Mechanical Systems Laboratory R&D Center, Toshiba Corp.
2) Faculty of Engineering, Toyama Prefectural University |
| | | In order to investigate the performance of the micro channel heat exchanger, three-dimensional numerical simulations and experiments on heat transfer behavior and pressure loss were carried out. So far as the heat transfer phenomena is concerned, results obtained using a silicon chip micro channel model showed a very small thermal resistance, about 0.1 (Kcm2/W). And, measured pressure loss showed good agreement with that of analytical result obtained on the basis of fully developed laminar pipe flow assumption. Furthermore, a practical setup was made with a micro channel heat exchanger to clarify the possibility of using the micro channel heat exchanger in electrical equipment. As a result, it was confirmed that the performance of the micro channel heat exchanger system is sufficient to cool a silicon chip which generates a large amount of heat, and the scale of the system is compact compared to that of the whole setup of electrical equipment. |
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| To cite this article: | | Koichiro KAWANO, Masayuki SEKIMURA, Ko MINAKAMI, Hideo IWASAKI and Masaru ISHIZUKA, “Development of Micro Channel Heat Exchanging”, JSME International Journal Series B, Vol. 44, No. 4 (2001), pp.592-598 . | |
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| doi:10.1299/jsmeb.44.592 | | JOI JST.JSTAGE/jsmeb/44.592 |
| Copyright (c) 2002 by The Japan Society of Mechanical Engineers |
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