@article{2004314, title={Effect of Ground Via Shielding on the Electrical Performance of Via Interconnections Embedded in a Multilayer PCB}, author={Taras KUSHTA and Kaoru NARITA and Takanori SAEKI and Hirokazu TOHYA}, journal={Journal of Japan Institute of Electronics Packaging}, volume={7}, number={4}, pages={314-321}, year={2004}, doi={10.5104/jiep.7.314} }