@article{2006, title={Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device}, author={Kohta NAGANO and Akihiro YAGUCHI and Takeshi TERASAKI and Kenichi YAMAMOTO}, journal={JSME International Journal Series A Solid Mechanics and Material Engineering}, volume={49}, number={2}, pages={220-228}, year={2006}, doi={10.1299/jsmea.49.220} }