Provider: Japan Science and Technology Agency Database: J-STAGE Content:text/plain; charset="utf-8" TY - JOUR TI - Effect of Grinding Method on Bending Strength of Silicon Nitride TI - AU - SAKAIDA,Yoshihisa AU - TANAKA,Keisuke JO - JSME International Journal Series A VL - 42 IS - 4 SP - 560 EP - 567 PY - 1999 DO - 10.1299/jsmea.42.560 ER -