Provider: Japan Science and Technology Agency Database: J-STAGE Content:text/plain; charset="utf-8" TY - JOUR TI - Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 mass% Ag-1.5 mass% Sb-xCu Solder Joints TI - AU - Lee,Hwa-Teng AU - Huang,Wen-Yeong JO - MATERIALS TRANSACTIONS VL - 50 IS - 4 SP - 899 EP - 908 PY - 2009 DO - 10.2320/matertrans.MER2008361 ER -