Provider: Japan Science and Technology Agency Database: J-STAGE Content:text/plain; charset="utf-8" TY - JOUR TI - Thermal and Mechanical Properties of Flip Chip Package with Au Stud Bump TI - AU - Ha,Sang-Su AU - Jung,Seung-Boo JO - MATERIALS TRANSACTIONS VL - 54 IS - 6 SP - 905 EP - 910 PY - 2013 DO - 10.2320/matertrans.MD201209 ER -