2009 年 129 巻 11 号 p. 746-750
This paper describes an uncooled infrared (IR) camera especially optimized for small size & weight, less power consumption without degrading noise equivalent temperature difference (NETD). This camera has two features, including a wafer-level chip scale vacuum package with 160x120 SOI-diode array and germanium lid for good IR transmission, and also a real-time signal correction capability with respect to ambient temperature. These features enabled the considerable size/power consumption reduction and the operation without thermoelectric cooler (TEC) which usual IR cameras require for temperature stabilization. As a result, we realized compact infrared camera (less than 71grams) with low-power consumption and excellent NETD of 22 mK (F/0.8 optics).
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