Journal of The Japan Institute of Electronics Packaging

Journal of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

3,594 registered articles
(updated on April 20, 2024)

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

JOURNAL PEER REVIEWED PARTIALLY RESTRICTED ACCESS ADVANCE PUBLICATION
Scopus

2024 Volume 27 Issue 2

News
Instruction for Authors
Announcement
Smart Inspection Monitoring Using High-Speed Camera Kohei Shimasaki, Feiyue Wang, Idaku Ishii

View all articles in current issue

Most viewed articles (March 2024)

1

Fundamentals of Thermosetting Resins

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 6 Pages 537-542

Masao TOMOI
2

Structure-Property Relationship in Polyimides

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 7 Pages 640-646

Yoshio IMAI
3

Fundamentals of Wire Bonding Technology for Semiconductor Devices

Released on J-STAGE: March 18, 2010 | Volume 5 Issue 4 Pages 412-417

Jin OHNUKI
4

Sintering Mechanisms in Ceramics

Released on J-STAGE: March 18, 2010 | Volume 6 Issue 3 Pages 266-273

Yusuke MORIYOSHI
5

The Past and the Future of Interposer Technology for Driving Solutions to High-Density Device Integration

Released on J-STAGE: August 01, 2019 | Volume 22 Issue 5 Pages 361-366

Osamu Shimada

Favorites & Alerts

Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

Top