Chemistry Letters
Online ISSN : 1348-0715
Print ISSN : 0366-7022
ISSN-L : 0366-7022
Letter
Enhanced Adhesion Strength between Silicon Substrate and Metal Film by Surface Fluorination
Fumihiro NishimuraJae-Ho KimSusumu Yonezawa
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2017 Volume 46 Issue 11 Pages 1643-1645

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Abstract

The surface of silicon wafer was treated with F2 gas at 25 °C for 10–120 min. The surface roughness (Ra) of silicon fluorinated for 120 min was 7 times larger than that (3.2 nm) of untreated silicon. Also, the water contact angle of fluorinated silicon decreased to 7°. The adhesion strength of Ni metal deposited on the silicon substrate could be enhanced by surface fluorination due to increased roughness and hydrophilic surface of the silicon substrate.

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© 2017 The Chemical Society of Japan
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