Abstract
A high-density semiconductor package needs detailed interconnection for the junction to a semiconductor tip and a package board. Furthermore, it also needs detailed wiring and the connection between layers of the small diameter of a package board. Therefore it is anxious about a fall of mechanical and the electric connection reliability of a connection part. Moreover, junction by the Au stud bump is adopted as FCBGA and MCM (Multi Chip Module) in which FC (Flip Chip) is mounted. By this method, a semiconductor tip is mounted in a package board under high temperature and high pressure. In the conventional package board, elastic modulus of material falls greatly at high temperature. Therefore the pad for bump connection sinks and it may cause poor connection. We developed high reliability semiconductor package board material.
