Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
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Host: Japan Institute of Electronics Packaging

Porous Polyimide PWB for High Frequency Applications(2)
Shinji Yamada, Takao Ishikawa, Toshiyuki Kawashima
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Keywords: porous polyimide, flexible printed circuit, low dielectric constant, low dielectric loss, RF module, mobile communication
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Pages 123

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[in Japanese]
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© 2002 by The Japan Institute of Electronics Packaging
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