Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
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Host: Japan Institute of Electronics Packaging

Reserch and Development of Active Interposer technology
Masahiro Okabe, Seiki Hiramatsu, Takeshi Ishitsuka, Hideto Furuyama, Kouichi Kumai, Seiji Karashima, Masao Kinoshita, Kenji Hiruma, Takashi Mikawa, Osamu Ibaragi
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Keywords: active interposer, three dimensional mounting, opto-electronics packaging, Vertical-Cavity surface-emitting laser
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Pages 135

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Abstract
Progress of Active interposer (AIP) which is conversion module between electrical and optical signal is described. AIP is a module by which LSI, VCSEL, and the driver, etc. are three-dimensionally mounted on the interposer substrate, and which is one of development technologies of national project “Research and Development for Super High-density Electronics System Integration”. The model was made for trial purposes aiming at the confirmation of a fundamental structure, and the signal transmission characteristic was evaluated
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© 2002 by The Japan Institute of Electronics Packaging
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