Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
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Host: Japan Institute of Electronics Packaging

Interconnection through-holes filled with conductive paste in silicon substrates using vacuum printing method
HIRONARI NAKAMURA, SATOSHI YAMAMOTO, TATSUO SUEMASU, TAKASHI TAKIZAWA, KENJI KANBARA
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Pages 146

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[in Japanese]
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© 2002 by The Japan Institute of Electronics Packaging
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