Abstract
As processing speed and frequency of electronic equipment are higher, it is required that the EMC countermeasures may be executed in design process of mounting and packaging, and it is important that we have to evaluate the electromagnetic radiation from PCB strictly and obtain the effective techniques to suppress the EMI. We have evaluated and investigated the electromagnetic radiation from a via hole to electrically connect between two layers in a multi-layered PCB model. This paper investigates relation between the crosstalk and the electromagnetic radiation in the multi-layered PCB model with various shapes of via holes. As a result, it was found that the circle via hole was more effective than conventional slit via hole.
