Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
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Host: Japan Institute of Electronics Packaging

One consideration to the via transmission characteristic in the high-speed signal on a printed circuit board
Takahiro Yagi, Takeshi Kobayashi, Naotoshi Shiotubo, Hideo Takakusagi
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Keywords: via, printed circuit board, transmission characteristic
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Pages 28

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Abstract
[in Japanese]
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© 2002 by The Japan Institute of Electronics Packaging
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