Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
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Host: Japan Institute of Electronics Packaging

PCB Recycling-system using PALAP-substrate technology
RIKIYA KAMIMURA, KOUJI KONDOU, SHINGETSU YAMADA, MASAO KAYABA
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Keywords: PALAP, PCB, Recycle
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Pages 33

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Abstract
[in Japanese]
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© 2002 by The Japan Institute of Electronics Packaging
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