Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
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Host: Japan Institute of Electronics Packaging

Evaluation of Solder Joint Reliability on Sn-Zn Solder with Pb-free Plated Lead and Metallographic Observation of Solder Joint
Izuru Komatsu, Hiroshi Tateishi, Hideki Ogawa, Nobuhiro Yamamoto, Yukio Takashima
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Keywords: Sn-Zn based Pb-free solder, Pb-free plated lead, Solder joint reliability, Heat storage test, Lead pull test
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Pages 36

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Abstract
A few reliability evaluations indispensable for using Pb-free solder have not been investigated, especially the amount of data of joint reliability on Sn-Zn solder with Pb-free plated lead is less than other Pb-free solders. In this study, we measured pull strength for joint of Sn-8Zn-3Bi solder with various Pb-free plated leads and observed solder joints metallographically. And we suggest that the joint of Sn-Zn solder with Pb-free plated lead have sure reliability, which is higher than with Sn-Pb plated lead.
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© 2002 by The Japan Institute of Electronics Packaging
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