Proceedings of JIEP Annual Meeting
The 16th JIEP Annual Meeting
Conference information

Host: Japan Institute of Electronics Packaging

Micro Solder Bump Formation using Solder Paste
Toshimasa Nagoshi, Osamu Shimada, Kazuhisa Suzuki
Author information
Keywords: Bump formation, Solder paste, Printing method, metal jig
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 45

Details
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2002 by The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top