The 19th JIEP Annual Meeting
Session ID : 17A-17
Conference information
Host: Japan Institute of Electronics Packaging
Development of Fluxless Reflow Process using Hydrogen Radical -2-
*Makoto Suenaga, Shingo Yoshida, Daisuke Hirakawa, Takashi Nakamori, Yasuhide Ohno, Taizo Hagihara, Johji Kagami, Tatsuya Takeuchi
Author information
Keywords:
Fluxless Soldering,
Lead Free Solder
Details
