Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 22B-11
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Host: Japan Institute of Electronics Packaging

Development of pattern design tool by thermal analysis
*Takashi Kurokawa
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Keywords: Thermal analysis, Finite Element Method, Pattern design, PCB, CAE
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[in Japanese]

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© 2006 by The Japan Institute of Electronics Packaging
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