Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 23A-01
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Host: Japan Institute of Electronics Packaging

Consideration of Solder Joints Mechanism for Electroless Ni-P Plating Film
*Yoshifumi Kanetaka, Naomi Ishizuka, Toshiya Suzuki, Shinichi Tamabayashi, Tomoo Murakami
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Keywords: Reliability of Solder Joints, Lead Free Solder Joints
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[in Japanese]

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© 2006 by The Japan Institute of Electronics Packaging
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