Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 23A-02
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Host: Japan Institute of Electronics Packaging

Reliability of Flip Chip Joint part of Au-Ag alloy and Sn
Michitaka Mikami, *Takatoshi Arikawa
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Keywords: Au-Ag alloy, Sn-3.5%Ag, Flip Chip, Wire Bump, Heat Treated
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[in Japanese]

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© 2006 by The Japan Institute of Electronics Packaging
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