Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 23A-04
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Host: Japan Institute of Electronics Packaging

Effect of ramp rate during temperature cycling test for solder joint reliability
*Takayuki Nagai, Yuichi Aoki, Ichisaku Tsujie
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Keywords: solder, temperature cycling
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]

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© 2006 by The Japan Institute of Electronics Packaging
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