Proceedings of JIEP Annual Meeting
The 20th JIEP Annual Meeting
Session ID : 23A-13
Conference information

Evaluation of Crack Growth for Solder Joints by Micro Resistance Behavior
*Yuichi AokiIchisaku TsujieYasutoshi NakagawaTakayuki Nagai
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract

[in Japanese]

Content from these authors
© 2006 by The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top