Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 5B-07
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Adsorption mechanism of copper additives on micro-irregularity surfaces
*Natsuki Takahashi, Tsugito Yamashita
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Keywords: Copper electro-deposition, Additives, Micro-irregularity surfaces
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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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