Surface Modification of Insulation Resin for Build-up Process Using TiO₂ as a Photocatalyst and Its Application to the Metallization

抄録

Fabrication of fine circuits on the printed circuit board (PCB) is one of the key process to realize the downsizing of electronic devices. Fine line circuits were created without roughening the surface of PCB and no extraneous deposition was observed between lines by introducing a surface modification by photocatalyst. Modified layer in depth of 20∼30 nm was produced on the PCB surface by the irradiation of UV light under the presence of TiO₂ as a photocatalyst. Adhesion was derived from the nano-level anchor effect by the formation of co-existed layer between modified PCB surface and deposited copper. This new surface modification method has an intrinsic advantage for the formation of fine patterned PCBs.