We have developed a new Die-to-Wafer (D2W) bonding process for a 3-D packaging technology called SMAFTI (SMArt chip connection with FeedThrough Interposer), which enables over a thousand parallel interconnects between memory and logic dies. The bonding process achieved metal/adhesive simultaneous bonding between die and wafer. We also characterized the interlaminar horizontal wiring of FTI (Feed Through Interposer) by Sparameter measurement and confirmed its potential for high frequency transmission at over 10 GHz.
