Analytical models of AC inductance and quality factor for TSV-based inductor

Abstract

Aimed at the emerging on-chip three-dimensional through-silicon vias (TSVs)-based inductor, the formula for the DC inductance is proposed. And then, based on this formula and the equivalent circuit model analytical models of AC inductance and quality factor are proposed considering frequency effect. Finally, the TSV-based inductors are fabricated and measured. It is shown that the reported results match very well with each other.