Electronic component placement optimization for heat measures of smartglasses

抄録

The thermal aware floor planning for VLSIs and thermal placement optimization of electronic components on printed circuit boards (PCBs) using genetic algorithms (GAs) are well studied. However, there are no technical paper on optimization of component placement considering the heat of smartglasses. In this paper, we propose a method for optimizing the placement of electronic components equipped on smartglasses using the elitist non-dominated sorting genetic algorithm (NSGA-II) and a thermal resistance circuit. Electronic components that have various dimensions and power consumptions are relocated to minimize the maximum temperature of parts around ears and areas often held by hands simultaneously. The experimental results show that the proposed method effectively reduced the maximum temperatures.