IEICE Electronics Express
Online ISSN : 1349-2543
LETTER
High-cycle fatigue of micromachined single crystal silicon measured using a parallel fatigue test system
Tsuyoshi IkeharaToshiyuki Tsuchiya
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JOURNALS FREE ACCESS

Volume 4 (2007) Issue 9 Pages 288-293

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Abstract

Fatigue testing of micromachined single-crystal silicon was performed using a test system that allowed simultaneous testing of multiple samples. The on-chip test structure, including an actuator, was fabricated using 0.6µm resolution lithography to improve the morphological uniformity of the samples. Fatigue test results exhibited a clear tendency for the lifetime to lengthen when the strain amplitude or ambient humidity was decreased. The strain-life relationship at 50%RH was analyzed using the Paris law, and a crack propagation exponent of 19 was obtained.

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© 2007 by The Institute of Electronics, Information and Communication Engineers
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