Edge Plating for Building Large Arrays and Low-Inductance Board-to-Board Connection

Junho Park; Dong Gun Kam

doi:10.1587/elex.15.20180953

This article has now been updated. Please use the final version.

Edge Plating for Building Large Arrays and Low-Inductance Board-to-Board Connection

Junho Park, Dong Gun Kam

Author information

Keywords: Edge plating, board-to-board connection, power distribution network (PDN), contiguous plane, low inductance

JOURNAL FREE ACCESS Advance online publication

Article ID: 15.20180953

DOI https://doi.org/10.1587/elex.15.20180953

The final version of this article is now available: Vol. 15 (2018), No. 24 pp. 20180953-20180953

Details

Abstract

This paper proposed the use of edge plating for direct board-to-board connection. Edge plating offers a contiguous reference plane for array antenna applications and can significantly reduce the loop inductance of power distribution networks.

Corresponding author

Register with J-STAGE for free!