Breaking behavior of laminated-glued three pieces of paperboard subjected to a shearing of punching tools
2022 年 9 巻 2 号 p. 09018-1-09018-10
詳細
2022 年 9 巻 2 号 p. 09018-1-09018-10
This work aims to reveal the shear deformation of stacked three pieces of 0.31mm thickness non-coated paperboard (based on virgin pulps for printing) subjected to a two-dimensional punch’s indentation against dies when changing the adhesive strength of the interlayers of the three pieces. Some generation of pull-out wastes from the sheared zone in the punching process was empirically reported. That seemed to be related to the releasing resistance of tangled fibers and sandwiched waste chips with the upper and lower layers. In this study, the effect of the adhesive resistance on the shear behavior and the generation of pull-out waste were investigated using two-dimensional punching shear test. The transient state of the fracture phenomenon of the three layers was observed by a high speed digital microscope. The difference of de-lamination behavior was detected with respect to the several adhesion states, and the breaking state of the lower and upper layers was revealed, while the middle layer was pull-out during the shearing process. Furthermore, the secondary cut of a small chip pulled out from the middle layer was detected when the adhesive strength of glued interlayers was relatively weak.
