電気学会論文誌C(電子・情報・システム部門誌)
Online ISSN : 1348-8155
Print ISSN : 0385-4221
ISSN-L : 0385-4221
<電子物性・デバイス>
アモルファスSiO2基板上へのc面配向ハイドロキシアパタイト成膜法の検討
岡田 悠希渡部 由香佐藤 匠海楠 正暢
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2019 年 139 巻 11 号 p. 1260-1265

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We investigated a fabrication technique of c-plane oriented hydroxyapatite (HA) crystalline film on low cost amorphous SiO2 substrates to apply the orientation-controlled HA crystal to disposal biochips. An experiment was conducted by the pulsed laser deposition (PLD) method. We showed that a high quality HA crystalline film was able to be grown by using a fluoroapatite (FA) buffer layer, which was self-oriented on amorphous SiO2. A relationship between a FA film thickness and the HA quality was examined with an aim of minimizing a toxic risk of F to biomolecules, even if it was eluted from FA. It was found that the thickness of the FA film could be reduced to about 7.5 nm, at the same time, the crystallinity and a smoothness of HA were also excellent. A crystal growth model of FA on the amorphous SiO2 was also studied. We considered that highly reactive F in a laser-ablated-plume substituted for O on the substrate surface, which became a migration trap, causing 3-dimensional island growth as FA crystal nuclei. This model consistently agreed with a series of experimental results.

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