2007 Volume 127 Issue 2 Pages 152-157
Chip mounters and surface mount device (SMD) inspection systems use image processing techniques for the placement of SMDs onto printed circuit boards (PCB) and the inspection of SMDs. Such techniques require the part shape data which define the shape of SMDs; however, the creation of this data is currently not automated. The goal of this paper is to make a system that generates part shape data automatically by processing images of SMDs. There are several target parts, such as IC, BGA (ball grid array), chips, and connectors, etc., for which data can be generated. In this paper we will focus on generation of data for IC parts.
The transactions of the Institute of Electrical Engineers of Japan.C
The transactions of the Institute of Electrical Engineers of Japan.B
The transactions of the Institute of Electrical Engineers of Japan.A
The Journal of the Institute of Electrical Engineers of Japan