アドミタンス行列を用いたプリント基板の熱解析技術の開発

抄録

This paper presents a thermal analysis technique for printed wiring boards using an admittance matrix. The proposed technique uses the similarly between electricity and heat, and can be applied to the modified nodal method that is generally used for electrical circuits. This technique can forecast the amount of temperature rise in a printed wiring board with high accuracy, regardless of the anisotropic thermal conductivity and the number of meshes in the finite element method. In this paper, we introduce a method for constructing an admittance matrix for a thermal analysis, and present the results of applying the analysis technique to the printed wiring board.