Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding

Abstract

This paper deals with the thermal resistance and thermal conduction characteristics of a Nickel Micro Plating Bonding (NMPB) power module in comparison with those of a power module adapting a conventional structure with a high-temperature solder attachment. An attempt is made to estimate the thermal resistance and thermal structure function for the two types of power modules when peeling of the chip junction occurs. In terms of spreading heat, an NMPB is superior to a conventional power module using high temperature solder, because NMPB allows spreading heat from both sides of the chip and setting the heat spreader near the chip.