Two-dimensional (2D) optical scanner has various applications particularly for building 3D micro optical cross connects (OXC). Most MEMS OXC reported today use electrostatic tilting mirror. However, the mirror-type 2D scanners have an optical alignment issue associated with fiber core deviation. In this paper, we propose a bulk micromachined electrostatic 2D scanner using silicon micro lens as an alternative method for optical scan. The lenses (diameter 260µm) and the driving actuators are integrated on the same layer of a silicon-on-insulator (SOI) wafer. This paper deals with the design, fabrication, and electromechanical characteristics of the bulk micromachined silicon scanner.