電気学会論文誌E(センサ・マイクロマシン部門誌)
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
特集論文
フッ酸,オゾン,HMDSを用いたMEMSデバイスの全気相処理によるスティクション力の低減
泰井 祐輔角嶋 邦之横川 隆司小野 志亜之高橋 琢二諫本 圭史鄭 昌鎬藤田 博之年吉 洋
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2007 年 127 巻 4 号 p. 221-227

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We propose a surface treatment technique to effectively avoid both process stiction and in-use stiction of silicon MEMS (microelectromechanical system) devices by using all-vapor processes: vapor HF (hydrofluoric) acid for sacrificial release, UV ozone for oxidation, and vapor HMDS (hexamethyldisilazane) for SAM (self-assembled monolayer) coating of small surface free energy. Adhesion force at every stage of the surface treatment was studied by using the force-curve of the AFM (atomic force microscope) measurement. HMDS-SAM coated silicon surfaces were found to have small adhesive strength of one fifth of that between the oxidized silicon surfaces. The effectiveness of the surface treatment was also experimentally validated by applying to an electrostatic optical MEMS scanner, which was practically used as a fiber-optic component.

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© 電気学会 2007
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