電気学会論文誌E(センサ・マイクロマシン部門誌)
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
研究開発レター
メッキ金の厚膜マスクによるRF-MEMSコプレーナ導波路の製作
山根 大輔李 宥憲藤田 博之年吉 洋
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2011 年 131 巻 3 号 p. 130-131

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This paper reports a novel silicon bulk-micromachining process using deep reactive ion etching (DRIE) of silicon and electroplating of gold in order to realize a low-loss radio frequency (RF) waveguide. The waveguide developed in the handle wafer was electrically isolated by air, laterally actuated to close metal-to-metal contacts, and driven by an electrostatic actuator integrated on the SOI sides by the layer-separation technique. A thinned silicon-on-insulator (SOI) wafer of high-resistive handle layer and low-resistive active layer was chosen to meet the process and design requirements for a compact low loss switch.

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