Special Issue Paper
Silicon Migration Seal Wafer-Level Vacuum Encapsulation
2020 Volume 140 Issue 7 Pages 165-169
Details
2020 Volume 140 Issue 7 Pages 165-169
Silicon migration seal (SMS) wafer-level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibility of SMS packaging was experimentally demonstrated using 4 inch wafers. Hermetic sealing was confirmed after 168 hours from the packaging process by diaphragm displacement in the cap wafer.
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