反応性イオンエッチングを用いた極薄チタンウェハのドライナノ研磨技術の開発

抄録

In this study, we developed a dry-nano-polishing technique using reactive ion etching for ultra thin titanium wafer. The surface of titanium coated with photoresist is polished by reactive ion etching using SF₆/C₄F₈ gas. Etching speed of titanium and photoresist were adjusted to close to each other by changing temperature and ratio of SF₆/C₄F₈ gas. By etching titanium under these conditions, the smooth surface shape of the resist was transferred to titanium. By combining with photolithography, it is possible to polish a specific part.