A high-density full color LED (light emitting diode) display panel was fabricated using LED array units which had many LED chips mounted on a silicon microreflector. The reflector was formed on a (100) silicon wafer by anisotropic chemical etching. The silicon microreflector absorbs the heat generated by the LED chips and improves their light directive characteristics. The three kinds of LEDs (red, green and blue) in a unit are arrayed with a matrix structure and the electric contacts between the LED chips, the reflector and the upper cover glass are formed using conducting silver resin.
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