Journal of Applied Glycoscience
Online ISSN : 1880-7291
Print ISSN : 1344-7882
ISSN-L : 1344-7882
Characterization of Wheat Flour Graded by Polishing and Its Application to Breadmaking
Tomoko MaedaMiki OhkuraNaofumi Morita
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1999 Volume 46 Issue 4 Pages 413-422

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Abstract

Characteristics of wheat flour graded by polishing and the effect of the graded flour substitution with conventionally milled flour on the physical properties of wheat dough and bread were studied. When wheat grains are milled by the conventional method, most of the fibers and minerals are lost. For that reason, a polished-grading method which keeps whole part of grains was introduced. Wheat grains were gradually polished in a:stepwise manner from the outer layer by 10% of the total weight to the core of the original soft-type wheat grain Normn 61. The loaf volumes of all graded flours were distinctly smaller than that of conventionally milled Normn 61 (N61) and the bread crumbs were quite hard. All graded flours clearly increased viscoelastic properties such as compression stress, modulus of elasticity and viscosity coefficient. The graded flours had a higher SH content, whereas there was a lower SS content in dough than conventionally milled hard-type flour. Any fraction of the polishedgraded flours alone did not have good baking properties. When 10% of N61 was substituted with a fraction of the graded flour, A-4 (70-60% of original grains) or A-7 (40-30%), the specific volume increased slightly as compared with that of N61 alone. Moreover, the addition of hemicellulase to the combined flour improved the loaf volume distinctly, and the bread crumbs became quite soft. Microscopic observation of the dough showed that the gluten matrix became thicker and most of the starch granules were sufficiently covered with the matrix, as compared with N61 alone. From these results, a 10% substitution of graded flours A-4 and A-7 to N61 with or without hemicellulase was found to improve some of the viscoelastic and baking properties of wheat dough.

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