理論応用力学講演会 講演論文集
第60回理論応用力学講演会
セッションID: OS01-12
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OS01 材料の力学特性のモデリングとその応用
Evaluation of Thin Film Elastic Modulus from Inverse Analysis of Multiple Indentation Unloading Curves
*プルー ジョリス岸本 喜久雄因幡 和晃コンスタンチネスクー アンドレイ
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A numerical method to identify thin films Young's modulus from multiple indentation unloading curves was suggested.
Usual inverse analyses make use of the whole indentation load-displacement curve, and thus require elasto-plastic finite element simulations. Subsequently, all the plastic properties should be identified the same time, leading to heavy computations. However, it was reported that the initial state of the indentation unloading can be considered elastic. For this reason, the proposed method by applying the inverse analysis only to this part of the unloading curve can then rely only on elastic finite element computations.
To ensure the applicability of the procedure, several factors that might affect its accuracy are addressed.
Finally, the method is confronted with experimental indentation data of Polyimide film on Glass/Epoxy substrate.

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