比較的低温で接着された超音波素子用接着剤の温度特性
1980 年 36 巻 2 号 p. 96-100
詳細
1980 年 36 巻 2 号 p. 96-100
In order to find good bonding materials applicable to the ultrasonic delay line operating over a wide temperature range, acoustic properties of five different bonding materials which are capable of bonding in the range of room temperature and can be used at the frequency of up to 100MHz, are investigated experimentally. By using the ultrasonic delay lines composed of LiNbO_3 or Y-cut quartz transducers, a fused quartz rod, and the bonding materials to be investigated, influence of bonding masterials on insertion loss is measured as a function of temperature by means of the pulse-echo method. The insertion loss of indium bonds which are applied by an ultrasonic bonding technique at room temperature is flat over the temperature range between -170^oC and 100^oC. It is proved that this bonding material is one of the excellent bonding materials capable of appling over a wide temperature range. Furthermore, bonding techniques and available temperature ranges of these materials are described in detail.
