Added arc glow discharge method is to deposit Cu metal electrode on ferrite ceramic chips in a vacuum atmosphere. A lot of phenomena, different from usual printing silver electrode method occurred during the deposition, as observed by scanning electron microscopy (SEM) the microstructure of electrode joints and energy-dispersive X-ray (EDX) analysis. Interfacial migration and diffusion occur within the metal layer and the ceramic matrix, respectively. The effect of different deposition procedures on the electrical and magnetic properties of the ceramic samples (chip and toroidal) was also investigated. The results show that, through an optimized procedure, the joint quality of deposited Cu electrodes and the properties of the relative components can significantly improved.