Mechanical Properties of High Thermal Conductive SiC Ceramics

Abstract

The mechanical properties of high thermal conductive SiC ceramics were studied. The bending strength was 430MPa at room temperature and raised to 720MPa at 1400°C, but it decreased to 630MPa at 1500°C. The fracture toughness was 3.8MPa·m^1/2 at room temperature and increased with increasing temperature, while Young's modulus was 460GPa at room temperature and decreased above 1300°C