Journal of the Ceramic Society of Japan
Online ISSN : 1348-6535
Print ISSN : 1882-0743
ISSN-L : 1348-6535
Technical reports
Direct-bonded aluminum on aluminum nitride substrates by transient liquid phase bonding
Yoshirou KUROMITSUYoshiyuki NAGATOMOKazuhiro AKIYAMANaoya SHIBATAYuichi IKUHARA
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2017 年 125 巻 3 号 p. 165-167

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A new bonding process has been developed for producing direct-bonded aluminum (DBA) substrates using aluminum nitride (AlN). A transient eutectic liquid phase forms in aluminum–X (X = silicon, germanium, silver, or copper) systems at the interface between the aluminum foil and the AlN substrate. The aluminum–X liquid phase transiently contacts the AlN substrate prior to isothermal solidification by diffusion of the element X into the aluminum foil. We have prepared DBA substrates using this process and demonstrated that they are highly stable after thermal cycling testing.

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© 2017 The Ceramic Society of Japan
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