Journal of Computational Science and Technology
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Modeling Electromigration for Microelectronics Design
Xiao ZHUHiren KOTADIASha XUHua LUSamjid MANNANChris BAILEYYancheong CHAN
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Volume 7 (2013) Issue 2 Pages 251-264

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Abstract

Computer simulation of electromigration (EM) in microelectronics devices has been reviewed and a multi-physics numerical simulation method has been proposed and developed so that the electric current, temperature, stress can be solved simultaneously and the vacancy concentration can be predicted in a seamless framework. The design considerations for resisting EM is also discussed in this work and a shunt structure for solder joint pad is proposed and its potential for the reduction of EM risk is demonstrated.

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© 2013 by The Japan Society of Mechanical Engineers
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