研究論文
バンプ形成状態が超音波フリップチップボンディングの接合性に及ぼす影響
2004 年 30 巻 1 号 p. 41-46
詳細
2004 年 30 巻 1 号 p. 41-46
Thermosonic flip-chip bonding is a low cost assembly method and has high productivity. In this bonding, the bump formed on a device chip is directly bonded to a substrate electrode in a short time. This paper describes the effect of bump condition on bondablity of flip-chip bonding. Experiments were carried out using a chip with aluminum electrodes and a gold-plated ceramic substrate. Two kinds of bumps that differ in strength and deformation were compared in flip-chip bondability. As a result, the highly deformed bump with high strength made bond strength between the bump and substrate electrode stronger. Additionally, bump deformation after flip-chip bonding and bond strength between the bump and chip electrode did not depend on the bump condition.
